• April 22-24, 2020
  • Shanghai

NEPCON Seminar on New Technologies and Reliability of Electronics Products

Time: 13:00-16:00, June 22, 2016

Location: Meeting Room 1, Floor 2, Between Hall 4 & 5

Key Topic

With the development of consumable products, industrial and communication equipment, as well as other electronics, board-level manufacturing technology is continuously

trending towards more integration, higher density and higher reliability. Electronics are also becoming more compact, multifunctional and highly integrated. To support

development, new technologies like SIP, POP, and 3D assembly are being more widely applied in electronics manufacturing.

Regardless of changes to electronics modality, end users' demand for high reliability will not change. They will still want long-lasting components and parts with smaller pin grid

spacing, large size BGA, better heat resistance, etc. The matter of how to avoid problems through good DFM design and the application of new technologies in the manufacturing

process will be closely examined.

To keep the public informed of the new technologies and methods arising in the manufacturing of electronics, in conjunction with Reed Exhibitions, ELETRAIN, the sole company

in China to focus on electronics manufacturing technologies - will join NEPCON West China in Chengdu to deliver a presentation on cutting-edge industry technologies. Join this

session to learn how technical capacity enhances production.