NEPCON Seminar on New Technologies and Reliability of Electronics Products
Time: 13:00-16:00, June 22, 2016
Location: Meeting Room 1, Floor 2, Between Hall 4 & 5
Key Topic
With the development of consumable products, industrial and communication equipment, as well as other electronics, board-level manufacturing technology is continuously
trending towards more integration, higher density and higher reliability. Electronics are also becoming more compact, multifunctional and highly integrated. To support
development, new technologies like SIP, POP, and 3D assembly are being more widely applied in electronics manufacturing.
Regardless of changes to electronics modality, end users' demand for high reliability will not change. They will still want long-lasting components and parts with smaller pin grid
spacing, large size BGA, better heat resistance, etc. The matter of how to avoid problems through good DFM design and the application of new technologies in the manufacturing
process will be closely examined.
To keep the public informed of the new technologies and methods arising in the manufacturing of electronics, in conjunction with Reed Exhibitions, ELETRAIN, the sole company
in China to focus on electronics manufacturing technologies - will join NEPCON West China in Chengdu to deliver a presentation on cutting-edge industry technologies. Join this
session to learn how technical capacity enhances production.