• April 22-24, 2020
  • Shanghai

PACKCON 2018 Electronics Industry Automatic Packaging Innovation Forum

Time Topic Speaker
10:00-10:25
The Tuyere is Changing! My Automatic Packaging Exploration and Innovation Road
Special Guest
10:25-10:50
Automatic Packaging——The Gamble of Efficient Production and Cost Reduction of Electronic Enterprises
Yongming Wei, Sales Director, Hangzhou Zhongya Machinery Co., Ltd.
10:25-10:50 10:50-11:15
Reading the "Big Trend" of China's Electronics Industry Packaging Development from The Big Events of The Year
Shenggwen Huang, Vice Director, China Packaging Federation Electronic Industry Packaging Technology Committee
11:15-11:40
New Electronics Packaging Anti-breakage and Cost Reduction Innovation Solutions
Shaoyong Li, R&D Department Design Engineer, MYS Group Co., LTD
11:40-12:00
Q&A